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The International Conference on Compound Semiconductor Manufacturing Technology
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P A P E R T I T L E
The Siemens 150mm GaAs Production Facility
A U T H O R / C R E D I T S
Otto Berger* and Robert Hochmuth+
*Siemens Semiconductor Group, HL GS PE GaAs, P.O. 801709 D-81617 Munich Germany
+Siemens Semiconductor Group, HL FE PTA, Otto Hahn Ring 6, D-81739 Munich Germany
e-mail: otto.berger@siemens-scg.com, robert.hochmuth@siemens-scg.com
http://www.siemens.de/semiconductor/
A B S T R A C T
For the first time the GaAs device suppliers are confronted with a real global market and an extraordinary dynamic business, that of wireless communication. The specific features of this market are permanent system innovations, steep production ramp-up curves and price levels of a consumer market.
A copy of the successful Si approach, i.e. 100% production orientation and flexibility combined with innovation leadership, can only manage this challenge.
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