Statistical
Quality Control of Wafer
Y.
Z. Wang, R. S. Persaud, R. C. Salvador and D. J. Troy,
Anadigics, Inc
Tel:
Keywords: Die Sort,
statistical quality control, yield, yield excursion
Abstract
In this report, we developed
a statistical quality ontrol (SQC) system associated in our test programs to
control wafer level DC Die Sort test by providing controls over TRI failures,
bin yield loss and mean and standard deviation variances of key parameters. This SQC system has dramatically reduced the
test caused yield loss ~1.2% since the tool was implemented. The yield excursions have been captured in
real-time from the control of bin yields and variability of the critical
parameters. Productivity is also greatly
improved by integrating automated recipe downloading and TRI re-test as well as
Die Sort disposition decision making into the process.